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August 2007

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 9 Aug 2007 09:46:49 EDT
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Hi Victor, 
You may also look at Engelmaier, W., “How to Specify PCBs to Reliably Survive 
RoHS-Mandated Lead-Free Soldering Processes,” IPC Review, Vol. 48, No. 7, 
August 2007, pp. 17-22, Engelmaier, W., “How to Specify Reliable PCBs for 
Lead-Free Solder Assembly,” Global SMT & Packaging, Vol. 6, No. 8, September 2006, 
pp. 54-56, Engelmaier, W., “How to Specify Reliable PCBs for Lead-Free Solder 
Assembly, Part 2,” Global SMT & Packaging, Vol. 7, No. 1, January 2007, pp. 
64-66, Engelmaier, W., “Printed Circuit Board Reliability: Loss of Life During 
Soldering,” Global SMT & Packaging, Vol. 6, No. 9, October 2006, pp. 46-47, 
Engelmaier, W., “Non-Functional Lands: Keep Them vs. Remove Them,” Global SMT & 
Packaging, Vol. 6, No. 6, June/July 2006, pp. 48-50, Engelmaier, W., “Printed 
Circuit Board Reliability Issues,” Global SMT & Packaging, Vol. 1, No. 3, 
October 2001, pp. 44-45; also in IPC Review, Vol. 46, No. 9, October 2005, pp.14-15. 
  
Enough?



Werner



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