Jeff.

I had to do this once and for the record here is how I did (and still would)
do it.

Take a camera and fix it in a stand looking vertically down at the base. On
the base you have tooling pins for your board.

Place board on the tooling pins and take a picture.

Remove board and using a standard sectioning equipment remove the solder
resist down to the copper layer 1 - take another photo. Grind down to copper
layer 2 - take another photo.

You will end up with all 12 layers, effectively "pin registered" that you
can scale from the original board size and re-create using a CAD system.

Have fun

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeff Seeger
Sent: Wednesday, August 08, 2007 9:02 AM
To: [log in to unmask]
Subject: [TN] reverse engineering, legit style

,
    Hallooo, Technet -

    I've been handed an unusual request, to try and duplicate a PWB
    from >10 years ago for a resupply type of contract.  The OE has
    officially declined participation and releases to that effect
    have been obtained.  Parts have largely been identified and are
    mostly sourced.

    My question is, what manner of tool stands a chance of imaging
    internal layers?  XRay Laminography?  A chance to stay in photo
    methods would sure help keep costs down.

    Board is reasonably small, 2x5 or so, and thankfully not jammed
    or superbly advanced for its era.  Layer count is at least 6,
    which would seem appropriate for what I see.  However there is
    one scary marking of 12L off to one corner.

    If by chance a vendor with expertise happens to be in earshot,
    I'd love a call.

    Thanks in advance - one more thing to try and sort out before
    vacation next week (ain't that the way)!

-- 
 
      Jeff Seeger                         Applied CAD Knowledge Inc
      Chief Technical Officer                  Tyngsboro, MA  01879
      jseeger "at" appliedcad "dot" com                978 649 9800

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