TECHNET Archives

August 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 7 Aug 2007 13:10:10 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (50 lines)
When you say pads are lifting, do you mean a partial or total adhesive
separation of the pad and laminate substrate or a cohesive failure of
the laminate itself under the pad?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ray, Carl (GE
Indust, GE Fanuc)
Sent: Tuesday, August 07, 2007 1:01 PM
To: [log in to unmask]
Subject: [TN] Pads removed during BGA Repair

All,
 Got a question or two for the group. We have a situation where we are
experiencing pads and traces being lifted during BGA removal. We use an
Summit 1800 Machine and have verified calibration and thermal profiles
(even used an external device, ECD Mole to verify the profiles and
temps). The products range in sizes as well as the BGAs. The surface
finish is ENIG and the board venders are the same for all the products.
Some of the products are Pb Free and others are standard lead products. 
 What types of testing can be done to verify tensile strength and copper
adhesion? What other actions would you recommend?

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2