All,
 Got a question or two for the group. We have a situation where we are experiencing pads and traces being lifted during BGA removal. We use an Summit 1800 Machine and have verified calibration and thermal profiles  (even used an external device, ECD Mole to verify the profiles and temps). The products range in sizes as well as the BGAs. The surface finish is ENIG and the board venders are the same for all the products. Some of the products are Pb Free and others are standard lead products. 
 What types of testing can be done to verify tensile strength and copper adhesion? What other actions would you recommend?

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