Or claim it was a case of mistaken i"dent"ity. This was a test for the
probing minds out there.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Tuesday, August 07, 2007 7:03 AM
To: [log in to unmask]
Subject: Re: [TN] Dent on BGA Pad
Reference IPC-6012B, section 3.5.4.2.2 "Round Surface Mount Lads (BGA
Pads)"
"One electrical test probe "witness" mark is allowed within the pristine
area for Class 1, 2, and 3."
The shape of the dent (great photo) definitely is indicative of a test
probe. While allowed, I also agree it looks a bit deep, so the advice
to
contact the supplier is sound. They may be able to swap pins for
something
with less force.
Good luck.
Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.
-----Original Message-----
From: Kane, Amol (349) [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2007 9:18 AM
To: [log in to unmask]
Subject: Re: [TN] Dent on BGA Pad
Thanks Steve and Kerry for the feedback.....greatly appreciated!...I
think I
will grab a hold of that spec and go thru it
Regards,
Amol
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2007 8:26 AM
To: Kane, Amol (349)
Cc: TechNet E-Mail Forum
Subject: RE: [TN] Dent on BGA Pad
Hi Again Amol!
I have your picture posted. It's at:
http://stevezeva.homestead.com/files/Dent_on_BGA_Pad.jpg
That looks like an awfully deep probe mark to me. Yes, something like
that
will cause voids.
I did find this in the IPC-6012A with Amendment 1 - Qualification and
Performance Specification for Rigid Printed Boards on page 10:
3.5.4.2
Surface Mount Lands - Defects such as nick, dents, and pinholes along
the
edge of the land shall not exceed 20% of either the length or width of
the
land for Class 2 or Class 3 boards, or 30% for Class 1. Defects internal
to
the land shall not exceed 10% of the length or width of the land for
Class 2
or Class 3 boards, or 20% for Class 1.
That sure looks like more than 10% to me...
Kind regards,
Steve Gregory
Production Engineer
OAI Electronics
6960 East 12th Street
Tulsa, Oklahoma 74112
(918) 836-9077 ext 507
(918) 836-0184 FAX
-----Original Message-----
From: Kane, Amol (349) [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2007 6:52 AM
To: Steve Gregory
Subject: RE: [TN] Dent on BGA Pad
Thanks Steve, here it is
Amol S. Kane
Process Engineer
Harvard Custom Manufacturing
941 Route 38
Owego, NY 13827
Phone: 607-687-7669 Ext. 349
Fax: 607-687-9733
Email: [log in to unmask]
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2007 7:49 AM
To: Kane, Amol (349)
Subject: RE: [TN] Dent on BGA Pad
Good Morning Amol!
Just go ahead and send it to me and I'll post it for you, then send you
a
link to the photo.
Kind regards,
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Tuesday, August 07, 2007 6:42 AM
To: [log in to unmask]
Subject: [TN] Dent on BGA Pad
Dear Technetters,
Lately, we have been receiving bare boards from our supplier with some
dents
on the BGA Pads (ENIG Finish). The dent is plated too (no exposed Ni).
What
kinds of assembly defects can potentially be associated with this
condition?
(voiding and coplanarity post reflow comes to mind). Are there any specs
that cover this kind of condition/defect? I want to reject this board
but
need something to stand by
I am sure that somebody else has seen this too, how was this dealt with?
Steve: I wish to post a picture of this condition, can you please direct
me
how to do it?
Thanks in advance,
Amol
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