In a previous life I worked at End Of Line Test for bare boards testing.
Probe dents are common and sometimes damage critical area. Destructive
analysis, cross and flat section, can provide useful information for
acceptability and/or non conformance. Probe marks can be found at End
points, mid point and from to back of a net. Many BGA have test marks
on critical pad to test the dog bone part of the net.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, August 07, 2007 7:26 AM
To: [log in to unmask]
Subject: Re: [TN] Dent on BGA Pad
Hi Again Amol!
I have your picture posted. It's at:
http://stevezeva.homestead.com/files/Dent_on_BGA_Pad.jpg
That looks like an awfully deep probe mark to me. Yes, something like
that will cause voids.
I did find this in the IPC-6012A with Amendment 1 - Qualification and
Performance Specification for Rigid Printed Boards on page 10:
3.5.4.2
Surface Mount Lands - Defects such as nick, dents, and pinholes along
the edge of the land shall not exceed 20% of either the length or width
of the land for Class 2 or Class 3 boards, or 30% for Class 1. Defects
internal to the land shall not exceed 10% of the length or width of the
land for Class 2 or Class 3 boards, or 20% for Class 1.
That sure looks like more than 10% to me...
Kind regards,
Steve Gregory
Production Engineer
OAI Electronics
6960 East 12th Street
Tulsa, Oklahoma 74112
(918) 836-9077 ext 507
(918) 836-0184 FAX
-----Original Message-----
From: Kane, Amol (349) [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2007 6:52 AM
To: Steve Gregory
Subject: RE: [TN] Dent on BGA Pad
Thanks Steve, here it is
Amol S. Kane
Process Engineer
Harvard Custom Manufacturing
941 Route 38
Owego, NY 13827
Phone: 607-687-7669 Ext. 349
Fax: 607-687-9733
Email: [log in to unmask]
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2007 7:49 AM
To: Kane, Amol (349)
Subject: RE: [TN] Dent on BGA Pad
Good Morning Amol!
Just go ahead and send it to me and I'll post it for you, then send you
a link to the photo.
Kind regards,
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Tuesday, August 07, 2007 6:42 AM
To: [log in to unmask]
Subject: [TN] Dent on BGA Pad
Dear Technetters,
Lately, we have been receiving bare boards from our supplier with some
dents on the BGA Pads (ENIG Finish). The dent is plated too (no exposed
Ni). What kinds of assembly defects can potentially be associated with
this condition? (voiding and coplanarity post reflow comes to mind). Are
there any specs that cover this kind of condition/defect? I want to
reject this board but need something to stand by
I am sure that somebody else has seen this too, how was this dealt with?
Steve: I wish to post a picture of this condition, can you please direct
me how to do it?
Thanks in advance,
Amol
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