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Subject:	Re: Baking out board moisture
From:	Larry Dzaugis <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Larry Dzaugis <[log in to unmask]>
Date:	Wed, 29 Aug 2007 15:30:06 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Could tg 170 material adsorb enough moisture in 2 weeks at 20C and 70Rh to 
cause delamination in a 1.5mm thisch 4 layer PCB?

The bake out time will vary with the thickness of the PCB and the number of 
layers i.e. 1mm double sided vs 2.3mm 24 layer will have signifactaly different 
paths for the mositure to escape. 
  

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