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August 2007

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Wed, 29 Aug 2007 07:58:05 -0400
Content-Type:
text/plain
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text/plain (98 lines)
Inge,
I think a lot of people would be interested in that. Could Steve post
it?
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Wednesday, August 29, 2007 2:22 AM
To: [log in to unmask]
Subject: Re: [TN] PCB matl properties - water effect

Hi Leo,
I have some data about hydrolysis for a glassfiber reinforced PWB type
that is similar to FR-4. Two diagrams on tensile modulus and tensile
strength vs. immersion in stem and water vs time up to 1,000 hs. Can
send offline if  you are interested.
Inge

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: den 28 augusti 2007 23:11
To: [log in to unmask]
Subject: [TN] PCB matl properties - water effect

Hi folks,
     I did not get any responses to my first try with this question, so
I will try again.  Can anyone provide reference info on the mechanical
properties of PCB materials when dry (baked out), and when saturated
with water vapor at a range of use temperatures?  I am especially
interested in modulus data, flexural strength, and any properties that
may effect a small board's response to impact in drop testing of
portable products.

     Thanks.



Best regards,
Leo

          
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc. 
13809 Research Blvd., Suite 635
Austin, Texas     78750

office phone   512-249-4758
mobile           512-423-2002
[log in to unmask]
www.asat.com

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