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August 2007

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Subject:
From:
Rob Strecker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rob Strecker <[log in to unmask]>
Date:
Tue, 28 Aug 2007 16:10:07 -0600
Content-Type:
text/plain
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text/plain (58 lines)
FYI,
We have now tried baking boards for 1hr @ 150degC with no solderability
issues, however we are still seeing delamination.  I suspect these
boards have not had the internal layer cured properly and no amount of
baking the finished product will resolve this issue.

Rob Strecker 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, August 28, 2007 2:22 PM
To: [log in to unmask]
Subject: Re: [TN] Baking out board moisture

Hi Inge,
The problem is not a higher moisture absorption with higher Tg, but the 
doubling of the vapor pressure for the same moisture absorption going
from 220 to 
260C.



Werner



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