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August 2007

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Tue, 28 Aug 2007 17:17:06 -0400
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Leo,
I would be interested in that too. I certainly don't have any data.   I
do wonder if the Motorolas and the Nokias of the world do, but will they
share? :)  I'm not sure I would if I had the data.

My GUESS would be that there would be little or not effect UNLESS there
was massive debonding of the glass fibers to the epoxy resin, which
could then also give you problems with regards to CAF growth.
Bev
RIM 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Tuesday, August 28, 2007 5:11 PM
To: [log in to unmask]
Subject: [TN] PCB matl properties - water effect

Hi folks,
     I did not get any responses to my first try with this question, so
I will try again.  Can anyone provide reference info on the mechanical
properties of PCB materials when dry (baked out), and when saturated
with water vapor at a range of use temperatures?  I am especially
interested in modulus data, flexural strength, and any properties that
may effect a small board's response to impact in drop testing of
portable products.

     Thanks.



Best regards,
Leo

          
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc. 
13809 Research Blvd., Suite 635
Austin, Texas     78750

office phone   512-249-4758
mobile           512-423-2002
[log in to unmask]
www.asat.com

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