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August 2007

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Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Tue, 28 Aug 2007 14:11:24 -0700
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Hi folks,
     I did not get any responses to my first try with this question, so I will try again.  Can anyone provide reference info on the mechanical properties of PCB materials when dry (baked out), and when saturated with water vapor at a range of use temperatures?  I am especially interested in modulus data, flexural strength, and any properties that may effect a small board's response to impact in drop testing of portable products.

     Thanks.



Best regards,
Leo

          
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc. 
13809 Research Blvd., Suite 635
Austin, Texas     78750

office phone   512-249-4758
mobile           512-423-2002
[log in to unmask]
www.asat.com

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