Final Bare board test pins, EOL Test
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Tuesday, August 07, 2007 6:42 AM
To: [log in to unmask]
Subject: [TN] Dent on BGA Pad
Dear Technetters,
Lately, we have been receiving bare boards from our supplier with some
dents on the BGA Pads (ENIG Finish). The dent is plated too (no exposed
Ni). What kinds of assembly defects can potentially be associated with
this condition? (voiding and coplanarity post reflow comes to mind). Are
there any specs that cover this kind of condition/defect? I want to
reject this board but need something to stand by
I am sure that somebody else has seen this too, how was this dealt with?
Steve: I wish to post a picture of this condition, can you please direct
me how to do it?
Thanks in advance,
Amol
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