Dear Technetters,
Lately, we have been receiving bare boards from our supplier with some dents on the BGA Pads (ENIG Finish). The dent is plated too (no exposed Ni). What kinds of assembly defects can potentially be associated with this condition? (voiding and coplanarity post reflow comes to mind). Are there any specs that cover this kind of condition/defect? I want to reject this board but need something to stand by

I am sure that somebody else has seen this too, how was this dealt with?

Steve: I wish to post a picture of this condition, can you please direct me how to do it?


Thanks in advance,
Amol

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