Hi All,

We are having an issue with boards delaminating post oven (oven profiles
are good).  We brought the issue up with our PCB manufacturer and they
said "The absorption of moisture on Tg170 laminate (Lead Free) is higher
than Tg130 laminate." Their corrective action is to increase the bake
time of the inner layer as well as additional drying process of 60min at
150oC before packing.  I am concerned with regards to the high bake
temperature and what it will do to our ENIG finish.  This is also the
recommendation they have given us to bake our existing stock before
running.  Could this reduce the solderability of our boards?  I know
with Tin finishes you would definitely have a problem with the Tin
degrading.  One other odd thing about this is we have been soldering
lead free for about 2 years now and started seeing issues in Jan of 07.

 

Rob Strecker 

 


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