Victor,
No there are not.  The only x-ray image of any type that quickly comes
to mind that is in the document is Figure 8-143 for BGA shorting. If
there are others I am sure I will hear about it.  :)

What exactly do you mean by solder pooling?  The main things we have
seen with PQFNs or LGAs is lack of solder paste or voiding in the
central ground plane solder joint.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Thursday, August 23, 2007 8:16 AM
To: [log in to unmask]
Subject: [TN] Thermal Back Plane Termination Devices, IPC-A-610D

Fellow TechNetters:

   Is there supporting x-ray images in IPC-A-610D for sections 8.2.13 -
8.2.14.
LF Solder pooling can occur if the solder paste stencil/geometry is not
compatible to device pad size.
What is the solder attachment criterion for % coverage?

Victor,

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