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August 2007

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Subject:
From:
Herminia Guevarra <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Herminia Guevarra <[log in to unmask]>
Date:
Wed, 1 Aug 2007 07:56:37 -0400
Content-Type:
text/plain
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text/plain (98 lines)
Ralph,

Found the same issue on VLP BGA design with just one side populated.

Root cause was determined to be PCB warpage.

Thanks,

Herminia 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Wednesday, August 01, 2007 7:36 AM
To: [log in to unmask]
Subject: Re: [TN] Problems with Memory modules and sockets

Have you inspected the socket in which the DIMM insert into.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ralph Rottnick
Sent: Wednesday, August 01, 2007 4:14 AM
To: [log in to unmask]
Subject: [TN] Problems with Memeory modules and sockets

Hi all,
I got a feedback from the market that some modules are causing problems 
during insertion to sockets. Significant is that the problems occur just
with 
PCBs from one supplier. I made correlation between different suppliers
but I 
could not find differences in any dimensions. All of the boards are not 
chamfered. Thickness is always within spec of 1.27 +/-0.1 mm. The boards

have 240 pins.

Is anybody out there who has experience in that? Are there any
influences 
related to core materials, gold hardness, gold finger design? Or is this
more 
socket related?

What are potential rootcauses?

Thanks in advance.
Ralph

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