Register now for this informative webcast series!

Via Hole Filling Technology and Processes 
November 1 & 8, 2007 10:00 am - 11:00 am (CST)
Instructor:  Michael Carano, Electrochemicals, Inc.

This IPC web cast series describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to the use of these via filling materials for highly complex circuit designs. 

November 1, 2007 - 10:00 am - 11:00 am (CST) 
Via Hole Filling Technology and Processes: An Overview

* Introduction to via filling
* What is via filling
* Technology drivers for via filling 
* Different types of via structures 
* Overview of via filling processes
* Filling via polymer materials
* Filling via plating
* Via fill by electroplating
* Theoretical considerations
* Plating additive design
* Plating process parameters
* Plating cell design
* Reliability
* Troubleshooting 

November 8, 2007 - 10:00 am - 11:00 am (CST)
Via Hole Filling Technology and Processes: The Rest of the Story 

* Introduction to via filling with polymer based materials 
* Why use polymer based materials 
* Conductive versus non-conductive via fills 
* Material considerations 
* Electrical/physical properties 
* Methods of via filling 
* Hand screening 
* Roller coating 
* Vacuum plugging equipment 
* Over metallization considerations 
* Troubleshooting 

Reserve your conference room and attend with colleagues, or log in on your own from the convenience of your home or office.  It's easy and it's inexpensive!

Register by October 1, 2007, and save an additional 10% off.  To register, please cut and paste www.ipc.org/ViaHoleWC into your browser and download the registration form.


Michelle Michelotti
Coordinator, Professional Development
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015
Phone: 847-597-2822
Fax: 847-615-5622
www.ipc.org 

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