Kerry,
Although I would not dispute Dewey's legitimate concerns we are in the
business of repair/rework of bare and assembled printed circuit boards.
The procedure you describe is performed with great success frequently at
our facility. The procedure 4.3.2 is detailed on our web sight
http://www.circuitrework.com/guides/4-3-2.shtml and also in the
IPC-7711A/7721A Standards (also procedure 4.3.2 in the IPC Standard).
I noticed your address on your email. Several samples of the epoxy we
use (CircuitMedic P/N 115-3302) have been sent to you today. I hope it
works for you. If you need more details relative the chemistries
involved the MSDS sheets can also be found on our website.
Regards,
Peter
Peter Vigneau
General Manager
[log in to unmask]
Circuit Technology Center
135 Ward Hill Avenue
Haverhill, MA 01835
Web: www.circuitrework.com
Phone: 978-374-5000
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerry McMullen
Sent: Thursday, August 16, 2007 8:17 AM
To: [log in to unmask]
Subject: Re: [TN] Drill Rework
And my super glue idea looks a little weak also.
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
825 University Avenue
Norwood, MA 02062-2643
(T) 781-467-5468
(C) 508-631-1832
(F) 781-461-0993
Phil Nutting <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/16/2007 07:52 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Phil Nutting <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Drill Rework
I guess this rules out Bazooka Bubble Gum.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Wednesday, August 15, 2007 5:21 PM
To: [log in to unmask]
Subject: Re: [TN] Drill Rework
I don't mean to sound holier than thou, but I don't like partial depth
drilling to cut traces and I don't advise filling a whole that is not
the sum of its parts. If this part went into John Burke's Refrigerator,
no one would care because the English like warm Beer anyway. However, if
there is integrity required or long term reliability, I would do
additional testing/cleaning of the hole before I applied a well
engineered epoxy with a structured process. Things to consider are as
follows:
* Verify TCE compliancy with FR4 substrate
* Verify ability to seal to prevent moisture/contamination
ingression
* Verify the by-products of the cure are not a potential
contaminant
* Verify the by-products of the cure are not potentially
corrosive
* Verify the by-products of the cure are not a growth medium
* Verify the by-products of the cure are not conducive to
forming an electrical migration path
* Verify bullets 3 through 6 are still acceptable in the
presence of humidity and a DC bias voltage
* Verify that the adhesive and it's by-products do no outgas
* Verify there are no amines in the formulation
* Verify that the adhesive does not create any occupational
hazards
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tony Steinke
Sent: Wednesday, August 15, 2007 2:28 PM
To: [log in to unmask]
Subject: Re: [TN] Drill Rework
Kerry,
A two part epoxy by 3M followed up with a 200F bake to fully cure should
be
fine.
Tony Steinke
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerry McMullen
Sent: Wednesday, August 15, 2007 2:28 PM
To: [log in to unmask]
Subject: [TN] Drill Rework
Hi,
I have a .062 FR406 board where I need to drill out a trace that is
causing a problem. The trace is .020" down in the board (Layer 4).
The
drill size is .012.
After I have drilled out (opened) the trace, what do you suggest I fill
the drill hole with?
We have done the rework, and it works fine. I am just curious as to if
I
should fill the hole with epoxy.
Thanks in advance,
Kerry
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
825 University Avenue
Norwood, MA 02062-2643
(T) 781-467-5468
(C) 508-631-1832
(F) 781-461-0993
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