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August 2007

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 15 Aug 2007 11:33:32 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (272 lines)
To add to your point, I've already seen customer complaints, who with
their hand held XRF, have found lead in the lead oxide of the glass frit
encapsulation of resistors...so we will use a different supplier who
doesn't have lead oxide :(  

And they have found Cr on the plated surface of caps.  Cr is commonly
confused with Antimony if one isn't careful with the analysis, but
apparently Cr3 is used somewhere in the plating on caps.  So we will get
it eliminated :(  

Can you see my head hanging low?


-Ryan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, August 15, 2007 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?

Bit academic in this case, the material in question is almost certainly
the
die attach solder which has been intentionally added.

Not sure if the matter has ever gotten into court which would be the
place
to resolve it.....8-)

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ryan Grant
Sent: Wednesday, August 15, 2007 10:04 AM
To: [log in to unmask]
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?

Was the definition of "homogenous" ever finally decided?  As I
understand, there was some debate because "homogenous" was defined as
'able to be mechanically separated'.  I've never really been successful
at mechanically separating an encapsulation from a substrate, but
chemical separation works well!  Nor have I been successful at
mechanically separating resin from glass or plating from a base metal,
etc.  

(I bring this up because I'm being asked to chase down independent lab
analysis at the chemical declaration sheet level because of the
"homogenous" term)

-Ryan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, August 15, 2007 10:47 AM
To: [log in to unmask]
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?

It would still be non compliant the limits are for homogenous material
not
for the assembly.

John

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lenny Carter
Sent: Wednesday, August 15, 2007 10:10 AM
To: [log in to unmask]
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?

Encapsulation will not make the COMPONENTS ROHS compliant, but maybe the

ASSEMBLY ROHS compliant as it is my understanding that the ROHS
compliancy 
is based on mass (or weight) of the assembly in question.
Encapsulating the assy will greatly increase the weight of it and
therefore 
decrease the % of lead in the assembly based on it's weight.
Just a different perspective.
Lenny Carter
Design Engineer
ERG, Inc.
www.ergpower.com

----- Original Message ----- 
From: "Eric CHRISTISON" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 15, 2007 9:59 AM
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?


> As fas as I'm aware encapsulation doesn't make a product ROHS
compliant.
>
> Phil Nutting wrote:
>> Good morning,
>>
>> We have a component that in the PTH form is RoHS compliant, but the
SMT
>> is not.  The manufacturer states that it has to do with thermal
>> performance of the D2PAK.  It has been suggested that if we
encapsulated
>> the part it would become RoHS compliant.
>>
>> I have two issues with this; 1) difficulty of encapsulating a single
>> part on a circuit board after reflow assembly and conformal coating
does
>> not count, and 2) I don't believe simply encapsulating the part will
>> make it comply with the requirements of RoHS.
>>
>> We would like to avoid redesigning the board for the PTH part.
>>
>> Am I correct in my assumption that encapsulation does not make a part
>> RoHS compliant?
>>
>> Any suggestions for a solution?
>>
>> Thanks in advance.
>>
>> Phil Nutting
>> Design for Manufacturing Engineer
>> Kaiser Systems, Inc.
>> 126 Sohier Road
>> Beverly, MA 01915
>> voice: 978-922-9300 x1310
>> fax: 978-922-8374
>> e-mail: [log in to unmask] www.kaisersystems.com
>>
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>
> -- 
> Eric Christison Msc
> Mechanical Engineer
> Home Personal, Communication Sector
> Imaging Division
>
> STMicroelectronics (R&D) Ltd
> 33 Pinkhill
> Edinburgh EH12 7BF
> United Kingdom
>
> Tel: +44 (0)131 336 6165
> Fax: + 44 (0)131 336 6001
>
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