I wonder about the inability to rework any defective or failing
components or the ability to remove them for purposes of failure
analysis, the inability to inspect the copper buildup connection
directly at the component leads, the reliability of the buildup
connection to the component leads, the issues of potential heat
entrapment (in spite of thermal potting), how do you pot up something
like a large transformer or a 1 ufarad can capacitor, access to
trimpots, slide switches, etc.
Also, from a test/troubleshooting standpoint, unless all of the
terminations of every component are accessible for probing, how does one
go through the unit and verify the inputs/outputs of each component
unless they all go out to test points, and if that is the case, just how
dense is the assembly going to be with a large multitude of test
points/trace buildups all over the surface of the module, and how to
identify the particular test points, etc.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Thursday, August 02, 2007 10:47 AM
To: [log in to unmask]
Subject: Re: [TN] "IT"????
While the concept seems elegant and ingenious, you're probably not
hearing much from the assemblers because it would result in such a huge
paradigm shift.
Imagine not being able to manufacture a board until the complete parts
kit was assembled. Imagine making one single part placement error
(rotation, wrong p/n) and not being able to fix it after the fact?
Imagine an engineer requesting a resistor VALUE change. Or any
combination of three dozen of those, which we deal with every day.
Almost every assembly of ours has a TALL component.
What about that?
And who will make the boards? If a modern fab shop can incorporate the
pick and place and testing, who will need traditional assemblers? Or at
least the traditional assemblers will need to invest in a huge amount of
new equipment and technical expertise.
but from a design guy like me? a guy who can:
get rid of conformal coating?
solve some vibration issues?
get more routing not needing those big soldering pads?
no solder shorts?
less thermal events?
one-stop shopping?
smaller size and cost?
To a guy like me, it sounds like a brilliant "wave of the future"
kind of thing. Not appropriate for every application, but it could be a
heckuva good thing to have in my toolbox, ya know?
seems like something I woulda thought of myself, (grin) Jack
-----Original Message-----
*Subject:*
Re: "IT"???? *From:* Dave Dixon <*[log in to
unmask]*<http://listserv.ipc.org/scripts/wa.exe?LOGON=A2%3Dind0708%26L%3
DTechNet%26D%3D0%26T%3D0%26P%3D1822>
> *Reply-To:* TechNet E-Mail Forum <*[log in to
> unmask]*<http://listserv.ipc.org/scripts/wa.exe?LOGON=A2%3Dind0708%26L
> %3DTechNet%26D%3D0%26T%3D0%26P%3D1822>>,
Dave Dixon <*[log in to
unmask]*<http://listserv.ipc.org/scripts/wa.exe?LOGON=A2%3Dind0708%26L%3
DTechNet%26D%3D0%26T%3D0%26P%3D1822>
> *Date:* Wed, 1 Aug 2007 12:56:52 -0500 *Content-Type:* text/plain
I just read over the White (Green?) Paper, and find the process very
interesting. I'm by no means an expert on board fabrication and
assembly, so was looking forward to seeing comments from those of you
who have much more knowledge than myself. So, what da ya all think?
Dave
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, August 01, 2007 9:06 AM
To: [log in to unmask]
Subject: Re: "IT"????
Thanks, Steve
Here's better link, though...
*http://www.verdantelectronics.com/process.php*
<http://www.verdantelectronics.com/process.php>
seeya,
Jack
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