It would still be non compliant the limits are for homogenous material not
for the assembly.
John
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lenny Carter
Sent: Wednesday, August 15, 2007 10:10 AM
To: [log in to unmask]
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?
Encapsulation will not make the COMPONENTS ROHS compliant, but maybe the
ASSEMBLY ROHS compliant as it is my understanding that the ROHS compliancy
is based on mass (or weight) of the assembly in question.
Encapsulating the assy will greatly increase the weight of it and therefore
decrease the % of lead in the assembly based on it's weight.
Just a different perspective.
Lenny Carter
Design Engineer
ERG, Inc.
www.ergpower.com
----- Original Message -----
From: "Eric CHRISTISON" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 15, 2007 9:59 AM
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?
> As fas as I'm aware encapsulation doesn't make a product ROHS compliant.
>
> Phil Nutting wrote:
>> Good morning,
>>
>> We have a component that in the PTH form is RoHS compliant, but the SMT
>> is not. The manufacturer states that it has to do with thermal
>> performance of the D2PAK. It has been suggested that if we encapsulated
>> the part it would become RoHS compliant.
>>
>> I have two issues with this; 1) difficulty of encapsulating a single
>> part on a circuit board after reflow assembly and conformal coating does
>> not count, and 2) I don't believe simply encapsulating the part will
>> make it comply with the requirements of RoHS.
>>
>> We would like to avoid redesigning the board for the PTH part.
>>
>> Am I correct in my assumption that encapsulation does not make a part
>> RoHS compliant?
>>
>> Any suggestions for a solution?
>>
>> Thanks in advance.
>>
>> Phil Nutting
>> Design for Manufacturing Engineer
>> Kaiser Systems, Inc.
>> 126 Sohier Road
>> Beverly, MA 01915
>> voice: 978-922-9300 x1310
>> fax: 978-922-8374
>> e-mail: [log in to unmask] www.kaisersystems.com
>>
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>
> --
> Eric Christison Msc
> Mechanical Engineer
> Home Personal, Communication Sector
> Imaging Division
>
> STMicroelectronics (R&D) Ltd
> 33 Pinkhill
> Edinburgh EH12 7BF
> United Kingdom
>
> Tel: +44 (0)131 336 6165
> Fax: + 44 (0)131 336 6001
>
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