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August 2007

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Subject:
From:
Mike Fenner <[log in to unmask]>
Reply To:
Date:
Wed, 15 Aug 2007 17:14:52 +0100
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Encapsulation would only make it harder to tell non-compliance. 
Could you form the leads to make them SMT? 



Regards 

Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: Wednesday, August 15, 2007 4:00 PM
To: [log in to unmask]
Subject: Re: [TN] Does encapsulation make a part RoHS compliant?

As fas as I'm aware encapsulation doesn't make a product ROHS compliant.

Phil Nutting wrote:
> Good morning,
>
> We have a component that in the PTH form is RoHS compliant, but the SMT
> is not.  The manufacturer states that it has to do with thermal
> performance of the D2PAK.  It has been suggested that if we encapsulated
> the part it would become RoHS compliant.
>
> I have two issues with this; 1) difficulty of encapsulating a single
> part on a circuit board after reflow assembly and conformal coating does
> not count, and 2) I don't believe simply encapsulating the part will
> make it comply with the requirements of RoHS.
>
> We would like to avoid redesigning the board for the PTH part.
>
> Am I correct in my assumption that encapsulation does not make a part
> RoHS compliant?
>
> Any suggestions for a solution?
>
> Thanks in advance.
>
> Phil Nutting
> Design for Manufacturing Engineer
> Kaiser Systems, Inc.
> 126 Sohier Road
> Beverly, MA 01915
> voice: 978-922-9300 x1310
> fax: 978-922-8374
> e-mail: [log in to unmask] 
> www.kaisersystems.com
>
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>   

-- 
Eric Christison Msc
Mechanical Engineer
Home Personal, Communication Sector
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001

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