Good morning,

We have a component that in the PTH form is RoHS compliant, but the SMT
is not.  The manufacturer states that it has to do with thermal
performance of the D2PAK.  It has been suggested that if we encapsulated
the part it would become RoHS compliant.

I have two issues with this; 1) difficulty of encapsulating a single
part on a circuit board after reflow assembly and conformal coating does
not count, and 2) I don't believe simply encapsulating the part will
make it comply with the requirements of RoHS.

We would like to avoid redesigning the board for the PTH part.

Am I correct in my assumption that encapsulation does not make a part
RoHS compliant?

Any suggestions for a solution?

Thanks in advance.

Phil Nutting
Design for Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
voice: 978-922-9300 x1310
fax: 978-922-8374
e-mail: [log in to unmask] 
www.kaisersystems.com

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