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August 2007

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Subject:
Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Date:
Wed, 15 Aug 2007 16:18:16 +0200
Content-Type:
text/plain
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text/plain (73 lines) 
Graham

I don't know if I understood your question righ, but they must melt together, otherwise you would have to heat the solder joint to 327°C to melt the lead. Are there tin- lead phases and lead tin phases with gaps in between or is the surface of the joint uneven?


Best regards
Guenter



_____________________________________________________

EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 44 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]
_____________________________________________________

>>> Graham Naisbitt <[log in to unmask]> 08/15/07 12:24 pm >>>
Techies

Apropos the earlier exchange, take a look at this link: http:// 
news.bbc.co.uk/1/hi/technology/6946042.stm

Maybe all will be well with the XBox in 2011?

How about this curious problem: I have a client suffering from an  
apparent refusal of the tin and lead to meld together in his process  
but on on 1 to 10 individual joints per assembly. It looks like a  
cold joint (stay off this Dewey!) yet the joint is hard but separated  
metals - anyone got any clues? Pretty much every conceivable test has  
been run without a solution.

What could prevent tin and lead melding - Mr Hillman or Mr Pauls?

Kindest regards
Graham Naisbitt

[log in to unmask] 

www.gen3systems.com 

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


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