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August 2007

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Subject:
From:
Gerald Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerald Bogert <[log in to unmask]>
Date:
Tue, 14 Aug 2007 18:23:16 -0400
Content-Type:
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text/plain (68 lines)
August 14, 2007

Good question.  

I also need info in this regard for SAC for all type of component
leads/terminations that may be finished with SAC.

Is it better from a reliability standpoint to just live with a SAC finish
for SnPb assembly level soldering, or otherwise re-work the components to
replace the SAC with SnPb? 

Are we at the point yet where we can reliably predict equipment life in the
field for SAC alloy as compared to SnPb alloy?  I have need seen any widely
accepted industry papers yet that equate accelerated life testing results to
expected product fieldlife using SAC alloy. 

On a related issue, for pure tin, I understand that NEMI is not endorsing it
unless there is a nickel under-plate.  Just annealing after plating for pure
tin plated parts is not acceptable per NEMI recommendations.

I believe Dave Hillman of Rockwell published some data regarding soldering
to SAC with SnPb solder.

If you get any info on SAC or pure tin plated leads/terminations, I would
appreciate it if you could forward to me.  Thanks.  Seems like when I post a
question to Tech-Net, I get very few answers.  Could be my questions are
difficult to answer.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
Sent: Tuesday, August 14, 2007 4:51 PM
To: [log in to unmask]
Subject: [TN] SAC Soldered With SnPb

We are a Class 3 manufacturer and are looking at the different lead
finishes that can be soldered successfully with SnPb. One that we are
having a hard time finding information on is SAC lead finish soldered
with SnPb. I know that it's not good practice for BGA's but what about
SMT and through-hole parts?

Thanks in advance,

KennyB

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