Two sessions remain!  

PCB Fabrication "Back to the Basics" Webcast Series
Instructed by:  Michael Carano, Electrochemicals, Inc.
August 16 & 23, 2007 10:00 am - 11:00 am (CDT) 

August 16        Via Formation and Metallization
Learn everything you need to know about via formation and metallization.
This second webcast in the series will feature via formation with
reference to drilling basics, feeds and speeds, drill bit quality and
the effect of drilling on hole wall quality. Desmear/etchback with
reference to material concerns will also be explored. 

August 23        Electroplating Technologies
The third webcast in the series will discuss electroplating technologies
(i.e., pattern and panel plating), and provide an overview of the
plating process and factors affecting plating distribution and throwing
power. Don't miss out on this opportunity to learn everything you need
to know about the electroplating process! 
Please cut and paste www.ipc.org/PWBFabSeries into your browser or
contact Michelle Michelotti at +1-847-597-2822 or
[log in to unmask] to register!

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