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Subject:	Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation
From:	"Stadem, Richard D." <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:	Thu, 9 Aug 2007 14:36:58 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

You're not going to get a COOOL Mountain Dew from Werner, more like a
glass of room-temperature pine tar. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, August 09, 2007 1:36 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-A-600F, Sec 4.2.6, Core Bond to
Plated-Through-Hole Wall Separation

Ok Victor, what do you really need-besides a COOOOL Mountain Dew?



Werner



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