Many thanks to all who replied to my questions.
Your excellent responses really helped.

Best regards.

Ted Klefisch


On 8/27/07, Klefisch, Ted J <[log in to unmask]> wrote:
>
> Hello Designers,
>
> I work for a medical OEM.  We will soon be producing RoHS-compliant
> PCBA's.  I am not sure what exactly to include in the fab notes to
> specify the PCB base materials for compatibility with lead-free
assembly
> temperatures.
>
> For pre-RoHS boards I have included a note on the fab drawing that
> specifies "FR4, copper-clad laminates" plus board thickness and UL
> rating requirements.  Our boards are generally .062" thick and
8-layers
> or less.  As far as I know, we've always used conventional FR4.
>
> What would you suggest I include in a fab drawing note to assure that
> the boards survive the higher assembly temperatures?  Is it enough to
> specify decomposition temperature alone or should glass transition
> temperature also be called out?  Td=330C?  Tg=150C?
>
> I really appreciate your suggestions and advice.
>
> Thank you.
>
> Ted Klefisch, CID
> Covidien
> 444 McDonnell Blvd.
> Hazelwood, MO 63042
>
>
>
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