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Tue, 28 Aug 2007 16:10:07 -0600 |
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FYI,
We have now tried baking boards for 1hr @ 150degC with no solderability
issues, however we are still seeing delamination. I suspect these
boards have not had the internal layer cured properly and no amount of
baking the finished product will resolve this issue.
Rob Strecker
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, August 28, 2007 2:22 PM
To: [log in to unmask]
Subject: Re: [TN] Baking out board moisture
Hi Inge,
The problem is not a higher moisture absorption with higher Tg, but the
doubling of the vapor pressure for the same moisture absorption going
from 220 to
260C.
Werner
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