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July 2007

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Subject:
From:
"Valdez, Raul (.)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Valdez, Raul (.)
Date:
Fri, 13 Jul 2007 10:21:07 -0400
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Hello team,

Can anyone help me on this??IŽd like toknow if there is an IPC spec for
electronic components like perpendicularity on through hole encoders, if the
encoder placement on the electronic assembly is tilted then it affects the
next sub-assembly on the post-board assembly stage. There are other through
hole components like this encoder that are bigger than resistors,
capacitors, inductors, etc.

I'm asking because don't know if creating another spec will be like
re-inventing the wheel.

I was looking at the IPC specs tree:
http://www.ipc.org/4.0_Knowledge/4.1_Standards/SpecTree.pdf


Raul Valdez
Product Development 

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