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July 2007

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 2 Jul 2007 08:49:21 -0700
Content-Type:
text/plain
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text/plain (89 lines)
Old Aerospace requirements are as follows:

*         Any component which exceeds 7 grams in weight for every lead
of the device

*         Any D case size components

*         Any odd geometry which could induce a high moment arm of
inertia

*         Any component which failed Qual( thermal cycling and
vibration) due to solder joint fracture or lead to body failure( broken
lead, package cracks, resistance increase)

There are other reasons to bond, but you requested heavy parts/ epoxy
bonding relationships.

Dewey

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner
Sent: Monday, July 02, 2007 8:13 AM
To: [log in to unmask]
Subject: [TN] When to epoxy heavy components

 

Sorry I am posting again but I was not subscribed.

 

I would greatly appreciate it if someone could help refresh my memory to


remind me of the golden rule on heavy components when to apply epoxy.
Phil 

Zarrow wrote an article on this some years back.

 

Greatly appreciate.

 

 

Karen Ebner

 

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