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July 2007

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Subject:
From:
Ivanoe Pedruzzi <[log in to unmask]>
Reply To:
Date:
Thu, 12 Jul 2007 16:51:42 -0000
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just ..THANK YOU

Ivan


>Karen/all
>
>Doug Pauls of Rockwell-Collins put together a few papers about cleaning and 
>residues. Anyone can download from
>http://files.ipc.org/cleaning_papers.zip
>
>This zip file is about 4 MB. Be sure to right click the link and "Save target 
>as..." or you'll probably get an error msg.
>
>Jack
>
>Jack Crawford, IOM IPC Director Certification and Assembly Technology
>[log in to unmask]
>847-597-2893
>FAX  847-615-5693
>3000 Lakeside Drive, Suite 309 S
>Bannockburn, IL, 60015
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Ebner
>Sent: Thursday, July 12, 2007 7:35 AM
>To: [log in to unmask]
>Subject: Re: [TN] Dull SnPb solder joints
>
>That would be great! 
>
>If Brian would forward me his papers too I would appreciate that.
>
>[log in to unmask] 07/12/2007 08:18 AM
>
>To
>TechNet E-Mail Forum <[log in to unmask]>, Karen Ebner
><[log in to unmask]> cc
>
>Subject
>Re: [TN] Dull SnPb solder joints
>
>Hi Karen - Doug is on vacation but he should be able to recommend a couple of 
>reference sources for "white residue" upon his return. Hey
>Brian! What do you recommend as a good reference for the white residue
>question? 
>Dennis Bernier, Kester Solder, published a good paper on white residue
>causes and I'll see if I can find it in my files. 
>
>Dave 
>
>Karen Ebner <[log in to unmask]> Sent by: TechNet <[log in to unmask]>
>07/11/2007 08:57 AM 
>
>Please respond to
>TechNet E-Mail Forum <[log in to unmask]>; Please respond to Karen Ebner
><[log in to unmask]>
>
>To
>[log in to unmask]
>cc
>
>Subject
>Re: [TN] Dull SnPb solder joints
>
>Hi David
>
>How do I get hold of Brian Ellis and Doug Pauls papers?
>
>Please advise. 
>
>"David D. Hillman" <[log in to unmask]> Sent by: TechNet 
><[log in to unmask]>
>07/11/2007 09:19 AM
>Please respond to
>TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>[log in to unmask]
>
>To
>[log in to unmask]
>cc
>
>Subject
>Re: [TN] Dull SnPb solder joints
>
>Hi Jon - yes, potentially the same etching impact can give a slightly  white 
>appearance. Can you tell if there is a physical residue that is 
>causing the slightly white appearance? Or do you just have a metal 
>surface?  White residues on pwas are pretty common and are typically 
>associated with a cleaning process which is too hot resulting in rosin
>and 
>
>/or metal oxides that are contained in flux residues to be transformed  into an 
>insoluble lacquer coating on the pwa. Brian Ellis and Doug Pauls
>
>have both documented numerous white residue issues resulting from improper 
>
>cleaning of flux residues. An etching situation typically looks gray or  blueish 
>as the removal of tin from the solder joint surface leaves lead 
>which tends to give a dark visual appearance.
>
>Dave
>
>"Roberts, Jon" <[log in to unmask]>  07/11/2007 08:10 AM
>
>To
>"TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]>
>cc
>
>Subject
>RE: [TN] Dull SnPb solder joints
>
>David, Question, we have seen solder joints that have a dull appearance but also 
>exhibit having slightly white appearance. Could the cause
>mentioned in these emails have could cause what we have seen
>periodically?  Jon
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
>Sent: Wednesday, July 11, 2007 7:39 AM
>To: [log in to unmask]
>Subject: Re: [TN] Dull SnPb solder joints
>
>Hi folks! I can add some additional detail to Guy's observations. The dull 
>solder joint appearance that Guy correlated to the fresh DI beds is a 
>result of the solder joint surfaces being slightly etched. The "fresh DI
>
>beds" result in a water pH that is slightly more acidic in nature than  "old DI 
>beds". This change in water pH results in a preferential etch of
>
>the tin in the tin/lead solder joint surfaces thus the dull visual  appearance. 
>A number of years ago, I ran into a situation where a number
>
>of printed wiring assemblies had been subjected to an excess number of  
>saponified cleaning cycles. The solder joints surfaces were soo etched 
>that the pwas looked "purple" - we dubbed the pwas "Barney boards" in 
>honor of the purple dinosaur cartoon show! This dull solder joint 
>discussion again demonstrates the visual appearance has very little to
>do 
>with the overall solder joint integrity.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>Guy Ramsey <[log in to unmask]> 
>Sent by: TechNet <[log in to unmask]>
>07/10/2007 09:10 AM
>Please respond to
>[log in to unmask]
>
>To
>[log in to unmask]
>cc
>
>Subject
>Re: [TN] Dull SnPb solder joints
>
>With fresh DI beds we get duller joints for a day or two. It was more pronounced 
>with the flux formula we used a year ago. We switched to get
>better control of the foam fluxer and got shiner joints, more like the
>joints from our reflow process. 
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
>Sent: Tuesday, July 10, 2007 9:22 AM
>To: [log in to unmask]
>Subject: [TN] Dull SnPb solder joints
>
>Dear Technetters,
>We are seeing dull SMT solder joints near some TH parts that go over the
>wave. The board top side temp is getting to 110C. using OA flux at wave 
>and
>SMT. The boards are immediately put thru an aqueous wash. The SMT joints
>were shiny coming out of SMT. The customer is noticing this because
>other
>areas of the board (except near the TH parts) look shiny.
>There are no residues on the joints as I tried to manually clean a joint
>with water and IPA and did not have any flux residue on the Q-tip.
>
>Has anybody else noticed this phenomenon?......the only literature I could
>find on dull SnPb joints says the dull appearance could be due to a
>"cold"
>joint, which I know is not the case. Even though this is not a defect I 
>want
>to know the reason for this to happen.
>
>Could the wave flux cause this issue?
>
>Amol
>
>-----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of 
>Bev Christian
>Sent: Tuesday, July 10, 2007 8:19 AM
>To: [log in to unmask]
>Subject: Re: [TN] Injury by array
>
>Jeff,
>Two other possibilities (both costing $) are:
>1) automatic board handler
>2) gloves
>
>I don't like either one, but there they are.
>Bev
>RIM
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of McGlaughlin, Jeffrey
>A
>Sent: Tuesday, July 10, 2007 7:23 AM
>To: [log in to unmask]
>Subject: [TN] Injury by array
>
>Oh wise and wonderful members of tech net -
>
>We have had to incidents in the past six months where assemblers have been
>cut while handling assembly arrays (2-up panels) for one of our
>products.
>This has elevated the issue to "Panic Mode" due to the involvement of 
>EHS&Q
>(environmental health, safety and quality). As the designer of the array
>I
>have been given ownership of the issue and am task with resolving it. 
>After
>20+years of handling boards and arrays I have never been cut, so I am 
>unsure
>as to what if any corrective action can be taken to prevent future 
>injuries.
>
>The specifics on the arrays -
>10.5" [267mm] x 12.0" [305mm] x 0.062" [1.6mm] thick
>2 - up for 4.7"[119.3mm] x 9.2" [233.6mm] PCB Minimum rail 0.38"[9.5mm] 
>Tab
>Route and Retain (mouse bite) Injuries occurred during loading of the 
>solder
>printer and during slide line operations for post reflow assembly.
>
>Any suggestions on what to tell our production group?
>
>Jeffrey McGlaughlin, CID Engineering Designer
>Battelle
>505 King Avenue
>Columbus Ohio 43201-2693
>(614)424-7582 Phone
>(614)458-7582 Fax
>PS Don't you just love all those  management buzzwords (underlined.)
>>;-D
>
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