Have previously modified stencils to reduced the print area by 30% by
reducing the area under part to a series of 6 mm round dots. Strange
that the shifting occurred after the move from hand to machine
placement- might have a difference in placement force or maybe there was
a slight shifting during hand placement- might have smeared paste over a
larger area and during coalescence might have pullet the parts back onto
the pads. 

Is this a no clean or water soluble solder paste?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Ebner
Sent: Tuesday, July 03, 2007 10:57 AM
To: [log in to unmask]
Subject: Re: [TN] When to epoxy heavy components

Hi Bill 

I have a LLCC castellated unit.  As mentioned when it was hand placed I
had no issues now that it is SMT placed it moves during reflow.  Per
your questions before our board is FR 4 and Rogers material.  The ground
plane solder is to minimize noise on our device is to eliminate noise. 

Please call me if you have a moment.

If you would also please elaborate more on the statement below would be
great.

 Any component which exceeds 7 grams in weight for every lead of the
device

Thank you

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------