With fresh DI beds we get duller joints for a day or two. It was more
pronounced with the flux formula we used a year ago. We switched to get
better control of the foam fluxer and got shiner joints, more like the
joints from our reflow process.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Tuesday, July 10, 2007 9:22 AM
To: [log in to unmask]
Subject: [TN] Dull SnPb solder joints
Dear Technetters,
We are seeing dull SMT solder joints near some TH parts that go over the
wave. The board top side temp is getting to 110C. using OA flux at wave and
SMT. The boards are immediately put thru an aqueous wash. The SMT joints
were shiny coming out of SMT. The customer is noticing this because other
areas of the board (except near the TH parts) look shiny.
There are no residues on the joints as I tried to manually clean a joint
with water and IPA and did not have any flux residue on the Q-tip.
Has anybody else noticed this phenomenon?......the only literature I could
find on dull SnPb joints says the dull appearance could be due to a "cold"
joint, which I know is not the case. Even though this is not a defect I want
to know the reason for this to happen.
Could the wave flux cause this issue?
Amol
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Tuesday, July 10, 2007 8:19 AM
To: [log in to unmask]
Subject: Re: [TN] Injury by array
Jeff,
Two other possibilities (both costing $) are:
1) automatic board handler
2) gloves
I don't like either one, but there they are.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of McGlaughlin, Jeffrey A
Sent: Tuesday, July 10, 2007 7:23 AM
To: [log in to unmask]
Subject: [TN] Injury by array
Oh wise and wonderful members of tech net -
We have had to incidents in the past six months where assemblers have been
cut while handling assembly arrays (2-up panels) for one of our products.
This has elevated the issue to "Panic Mode" due to the involvement of EHS&Q
(environmental health, safety and quality). As the designer of the array I
have been given ownership of the issue and am task with resolving it. After
20+years of handling boards and arrays I have never been cut, so I am unsure
as to what if any corrective action can be taken to prevent future injuries.
The specifics on the arrays -
10.5" [267mm] x 12.0" [305mm] x 0.062" [1.6mm] thick
2 - up for 4.7"[119.3mm] x 9.2" [233.6mm] PCB Minimum rail 0.38"[9.5mm] Tab
Route and Retain (mouse bite) Injuries occurred during loading of the solder
printer and during slide line operations for post reflow assembly.
Any suggestions on what to tell our production group?
Jeffrey McGlaughlin, CID
Engineering Designer
Battelle
505 King Avenue
Columbus Ohio 43201-2693
(614)424-7582 Phone
(614)458-7582 Fax
PS Don't you just love all those management buzzwords (underlined.)
>;-D
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