Dear Technetters,
We are seeing dull SMT solder joints near some TH parts that go over the wave. The board top side temp is getting to 110C. using OA flux at wave and SMT. The boards are immediately put thru an aqueous wash. The SMT joints were shiny coming out of SMT. The customer is noticing this because other areas of the board (except near the TH parts) look shiny.
There are no residues on the joints as I tried to manually clean a joint with water and IPA and did not have any flux residue on the Q-tip.
Has anybody else noticed this phenomenon?......the only literature I could find on dull SnPb joints says the dull appearance could be due to a "cold" joint, which I know is not the case. Even though this is not a defect I want to know the reason for this to happen.
Could the wave flux cause this issue?
Amol
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Tuesday, July 10, 2007 8:19 AM
To: [log in to unmask]
Subject: Re: [TN] Injury by array
Jeff,
Two other possibilities (both costing $) are:
1) automatic board handler
2) gloves
I don't like either one, but there they are.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of McGlaughlin, Jeffrey
A
Sent: Tuesday, July 10, 2007 7:23 AM
To: [log in to unmask]
Subject: [TN] Injury by array
Oh wise and wonderful members of tech net -
We have had to incidents in the past six months where assemblers have
been cut while handling assembly arrays (2-up panels) for one of our
products. This has elevated the issue to "Panic Mode" due to the
involvement of EHS&Q (environmental health, safety and quality). As the
designer of the array I have been given ownership of the issue and am
task with resolving it. After 20+years of handling boards and arrays I
have never been cut, so I am unsure as to what if any corrective action
can be taken to prevent future injuries.
The specifics on the arrays -
10.5" [267mm] x 12.0" [305mm] x 0.062" [1.6mm] thick
2 - up for 4.7"[119.3mm] x 9.2" [233.6mm] PCB
Minimum rail 0.38"[9.5mm]
Tab Route and Retain (mouse bite)
Injuries occurred during loading of the solder printer and during slide
line operations for post reflow assembly.
Any suggestions on what to tell our production group?
Jeffrey McGlaughlin, CID
Engineering Designer
Battelle
505 King Avenue
Columbus Ohio 43201-2693
(614)424-7582 Phone
(614)458-7582 Fax
PS Don't you just love all those management buzzwords (underlined.)
>;-D
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