Hi Werner
What other kind of issues could there be? We just went from hand
placement before reflow to smt placement before reflow. Since this time
our devices have skewed and hence, we have had poor solder fillets. We do
have solder being placed under the device ground plane also. Any
suggestions to minimize component movement during reflow greatly
appreciated.
Thanks
Werner Engelmaier <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/02/2007 01:08 PM
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Re: [TN] When to epoxy heavy components
Hi Karen,
Are you talking about castellated LLCCCs? What is the PCB substrate? You
may
well have much more serious issues, that cannot be solved with bonding.
Werner
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