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July 2007

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Subject:
From:
Kevin Glidden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kevin Glidden <[log in to unmask]>
Date:
Tue, 10 Jul 2007 08:02:31 -0400
Content-Type:
text/plain
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text/plain (67 lines)
Consider placing the arrays in process carriers for SMT process.  It would
require adjustment to your reflow profiles for the added mass, but with an
.062" thick PCB it shouldn't be a big issue.

Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.

 

-----Original Message-----
From: McGlaughlin, Jeffrey A [mailto:[log in to unmask]] 
Sent: Tuesday, July 10, 2007 7:23 AM
To: [log in to unmask]
Subject: [TN] Injury by array

Oh wise and wonderful members of tech net -

We have had to incidents in the past six months where assemblers have been
cut while handling assembly arrays (2-up panels) for one of our products.
This has elevated the issue to "Panic Mode" due to the involvement of EHS&Q
(environmental health, safety and quality). As the designer of the array I
have been given ownership of the issue and am task with resolving it.  After
20+years of handling boards and arrays I have never been cut, so I am unsure
as to what if any corrective action can be taken to prevent future injuries.

The specifics on the arrays -
10.5" [267mm] x 12.0" [305mm] x 0.062" [1.6mm] thick
2 - up for 4.7"[119.3mm] x 9.2" [233.6mm] PCB Minimum rail 0.38"[9.5mm] Tab
Route and Retain (mouse bite) Injuries occurred during loading of the solder
printer and during slide line operations for post reflow assembly. 

Any suggestions on what to tell our production group?

Jeffrey McGlaughlin, CID
Engineering Designer
Battelle
505 King Avenue
Columbus Ohio 43201-2693
(614)424-7582 Phone
(614)458-7582 Fax
PS Don't you just love all those  management buzzwords (underlined.)
>;-D

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