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July 2007

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Wed, 1 Aug 2007 09:00:26 -0700
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Sorry I had to resend since my mail had some issues due to which I could not go through your replies. Sorry everybody. Kindly resend your comments which u had sent

Rgds

Pradeep
Stadem, Richard D. wrote at Tue Jul 31 06:40:52 PDT 2007:
> 
>Pradeep,
>Did you get the response to this that I sent you? A number of people on
>the Technet forum are questioning why it was sent again? Was there
>additional information you need?
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of mp3
>Sent: Tuesday, July 24, 2007 11:50 AM
>To: [log in to unmask]
>Subject: [TN] ENIG solderability
>
>Dear Sir,
>
>We have been having a few complaints from our customers regarding
>problems wrt solderability, especially in SMD and BGA pads with ENIG
>finish. We have checked the solderability at our end as per IPC and we
>find it to be acceptable. The customer says he is following the same
>parameters as that for HASL boards for assembly. Can we get some details
>on the extra precautions wrt assy of ENIG boards
>
>Rgds
>
>Pradeep.M
>AGM - Customer Support
>Micropack Limited
>Plot#16, Jigani Industrial Area,
>Anekal Taluk, Bangalore - 562 106
>India
>Tel : 91 80 7825223 / 7825224
>
>
>-------------------------------
>Micropack Ltd, Bangalore, India
>
>
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--
Pradeep.M
AGM - Customer Support
Micropack Limited
Plot#16, Jigani Industrial Area,
Anekal Taluk, Bangalore - 562 106
India
Tel : 91 80 7825223 / 7825224


-------------------------------
Micropack Ltd, Bangalore, India


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