Yes. Perhaps my response was not sufficient, or not the information
Pradeep is looking for. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hogg, Blair K.
Sent: Monday, July 30, 2007 11:20 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG solderability

Didn't we just have this discussion last week? That soldering to ENIG
required higher temps and a longer TALT than HASL because the tin needs
to form intermetallics with nickel?

Blair

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of mp3
Sent: Monday, July 30, 2007 9:55 PM
To: [log in to unmask]
Subject: [TN] ENIG solderability

Date: Tue Jul 24 09:50:21 PDT 2007
From: [log in to unmask]
To: technet <[log in to unmask]>
Subject: ENIG solderability

Dear Sir,

We have been having a few complaints from our customers regarding
problems wrt solderability, especially in SMD and BGA pads with ENIG
finish. We have checked the solderability at our end as per IPC and we
find it to be acceptable. The customer says he is following the same
parameters as that for HASL boards for assembly. Can we get some details
on the extra precautions wrt assy of ENIG boards

Rgds

Pradeep.M
AGM - Customer Support
Micropack Limited
Plot#16, Jigani Industrial Area,
Anekal Taluk, Bangalore - 562 106
India
Tel : 91 80 7825223 / 7825224


-------------------------------
Micropack Ltd, Bangalore, India


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