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July 2007

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Subject:
IPC Workshop: Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer Printed Circuit Board Technology, 9/11-12/07, Bannockburn, IL
From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Mon, 30 Jul 2007 10:11:15 -0500
Content-Type:
text/plain
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Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer Printed
Circuit Board Technology
Sponsored by: NSWC-Crane
September 11-12, 2007- Bannockburn, IL
Instructors: Richard Snogren, Bristlecone, LLC & Jason Ferguson, NAVSEA
Crane

Register for this unique workshop today! Classic printed circuit board,
high density interconnect (HDI/microvia), and hybrid multilayer, flex
and rigid flex printed circuit board technology will be explored. Topics
include:

* PCB history 
* Process types 
* Common construction issues 
* Front-end engineering 
* CAD to CAM relationships 
* Documentation and quality 
* Classic MLB fabrication 
* Materials: conventional, advanced high performance, and hybrid 
* RF, microwave, digital and analog applications 
* Thermal considerations 
* Technology/cost trade-offs 
* How to evaluate a PCB manufacturing shop

Advanced PCB technologies and exotic interconnection structures,
including HDI/microvia, hybrid constructions and materials and, flex and
rigid flex, will also be discussed.

Early Registration - Register by July 31, 2007, and save an additional
10% off the current prices or receive a group discount - register three
individuals from your company at the same time and receive the fourth
registration FREE! 

To find out more information and to download the registration form,
please cut and paste the following into your browser
www.ipc.org/PCBTrain0907.

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