Pradeep
Are you both doing the test the same way or could it be that one is
doing dip & look and the other force measurement?
Kindest regards
Graham Naisbitt
[log in to unmask]
www.gen3systems.com
Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121
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On 31 Jul 2007, at 02:54, mp3 wrote:
> Date: Tue Jul 24 09:50:21 PDT 2007
> From: [log in to unmask]
> To: technet <[log in to unmask]>
> Subject: ENIG solderability
>
> Dear Sir,
>
> We have been having a few complaints from our customers regarding
> problems wrt solderability, especially in SMD and BGA pads with
> ENIG finish. We have checked the solderability at our end as per
> IPC and we find it to be acceptable. The customer says he is
> following the same parameters as that for HASL boards for assembly.
> Can we get some details on the extra precautions wrt assy of ENIG
> boards
>
> Rgds
>
> Pradeep.M
> AGM - Customer Support
> Micropack Limited
> Plot#16, Jigani Industrial Area,
> Anekal Taluk, Bangalore - 562 106
> India
> Tel : 91 80 7825223 / 7825224
>
>
> -------------------------------
> Micropack Ltd, Bangalore, India
>
>
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