This may seem a little obvious, but I always do that profiling by drilling
into the component using a dental drill.

While writing, I have noticed a number of people having problems with lead
free on 0201 components. I put this down to the higher temperature running
out the flux activity due to the tiny amount of solder paste. Obviously
nitrogen would help with this but was just wondering if anyone else was
seeing issues, as I have also seen issues with a 0.5 MM BGA device.

Anyone out there have any comments??

John

 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Thursday, July 26, 2007 2:22 PM
To: [log in to unmask]
Subject: [TN] microBGA rework

Hello gurus of the Technet,

 

 

We are trying to rework some microBGAs but there is not enough room under
the parts for a thermocouple and drilling a hole through the board is not an
option at this point.  

 

We are placing a thermocouple on the top of the components being reworked
and covering it with Kapton tape and the thermal profile we are using is
maxing-out at 215° C.

 

 

Does anyone have experience measuring the component temperature and not the
solder temperature and would they mind sharing their results?  Are we asking
for field defects because we are not measuring the solder temperature?

 

 

Thank you in advance,

 

David Tremmel

(847) 858-5540 - Cell

 


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