>Date: Tue Jul 24 09:50:21 PDT 2007
>From: [log in to unmask]
>To: technet <[log in to unmask]>
>Subject: ENIG solderability
>
>Dear Sir,
>
>We have been having a few complaints from our customers regarding problems wrt solderability, especially in SMD and BGA pads with ENIG finish. We have checked the solderability at our end as per IPC and we find it to be acceptable. The customer says he is following the same parameters as that for HASL boards for assembly. Can we get some details on the extra precautions wrt assy of ENIG boards
>
>Rgds
>
>Pradeep.M
>AGM - Customer Support
>Micropack Limited
>Plot#16, Jigani Industrial Area,
>Anekal Taluk, Bangalore - 562 106
>India
>Tel : 91 80 7825223 / 7825224
>
>



--
Pradeep.M
AGM - Customer Support
Micropack Limited
Plot#16, Jigani Industrial Area,
Anekal Taluk, Bangalore - 562 106
India
Tel : 91 80 7825223 / 7825224


-------------------------------
Micropack Ltd, Bangalore, India


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