Pankaj,
Refer to IPC-7095 regarding what the IPC determined to be acceptable
ball shapes in X-rays. 
You may wish to read Werner Engelmaier's column in the June edition of
Global SMT and Packaging. He has some excellent information there on
better shapes (columns) that will provide better solder joint
reliability for BGA packages.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karnwal, Pankaj
Sent: Tuesday, July 24, 2007 1:48 AM
To: [log in to unmask]
Subject: [TN] X-Ray image spec.

Dear TechNet users, hello
 
Is there any specification available for the X-Ray inspection, covering
the following points. 
1. Ball shape acceptance criteria of BGA. e.g..e. If the Pad on the PCB
is oval in shape & the BGA balls are round shape that which type of
image is acceptable after reflow soldering. 
 
2. How the changes in the ball shape of BGA can determine the soldering
quality. 
 
We are using a 5DX Agilent X-Ray M/C Mfg. by HP  
 
Any inputs are welcome 
 
Thanks
Pankaj Karnwal - Eng. QA 
BARCO      


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