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July 2007

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Subject:
From:
pras chop <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, pras chop <[log in to unmask]>
Date:
Tue, 24 Jul 2007 12:07:37 +0100
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Hi,
   
  This is regarding the panellization using the V-groove score line.
   
  Need information on what is the minimum and also the preferred DFM guideline for the distance between any SMT component body or pad on the board and the V-groove score line?
   
  (This is to prevent the cracking of the solder or the track during depanelling using the pizza cutter.)
   
  Please let me know what should be the above requirement for 
   
  1. Ceramic capacitor
  2. Tantalum capacitor
  3. Electrolytic capacitor
  4. Other SMT components
   
  Thanks for all the inputs.
   
  Rgds
  Prashant

       
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