Dear TechNet users, hello
 
Is there any specification available for the X-Ray inspection, covering
the following points. 
1. Ball shape acceptance criteria of BGA. e.g..e. If the Pad on the PCB
is oval in shape & the BGA balls are round shape that which type of
image is acceptable after reflow soldering. 
 
2. How the changes in the ball shape of BGA can determine the soldering
quality. 
 
We are using a 5DX Agilent X-Ray M/C Mfg. by HP  
 
Any inputs are welcome 
 
Thanks 
Pankaj Karnwal - Eng. QA 
BARCO      


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