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July 2007

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Subject:
From:
"Victor G. Hernandez" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 23 Jul 2007 10:37:24 -0500
Content-Type:
text/plain
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text/plain (135 lines)
I would also like to see the photos

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, July 16, 2007 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] Question about rework of paste in hole solder joints

Steve,
That would be useful.  Yes, please send.
Bev

-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]] 
Sent: Monday, July 16, 2007 12:17 PM
To: 'TechNet E-Mail Forum'; Bev Christian
Subject: RE: [TN] Question about rework of paste in hole solder joints

Hi Bev,
I can send you some pictures of some parts without what I would call IPC
standard hole fill that are used in a very rugged military environment
and
the customer has had no issues. They put these through heavy vibration,
thermal etc. with no issues but in all cases they had at least some
fill.
Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: July-16-07 11:44 AM
To: [log in to unmask]
Subject: [TN] Question about rework of paste in hole solder joints

Technetters,
Good morning!  We generally do not use PTH parts.  As a result, we do
not do wave soldering, but use paste-in-hole or pin-in-paste, chose your
moniker.  Because we buy the part in question from two different
suppliers, who make the parts with different dimensions, we have had to
use fairly large, oval holes instead of a more conventional round hole.
And the part leads do not stick out the bottom of the hole either.  With
overprinting we have been able to get what is deemed adequate solder
joint strength (and reliability (Yes, I know the difference, Werner.)),
even though the hole fill is not stellar. Wetting angles are good and
proper intermetallics are formed.

Now let's say we do a rework - removing the component, dressing the
hole, inserting a new part and resoldering using hand soldering with
cored wire.  The internal debate is whether we should demand hole fill
to meet normal IPC standards or whether we allow the same amount of hole
fill that is allowed for the original paste-in-hole.  Opinions and/or
experiences (if you are willing to share the latter :) ) appreciated.
Thanks in advance.

Bev 
RIM



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