Rich,

As someone has said before me, "it all depends" ...

I have known places making industrial types of wire bonded products that were 'maybe' as good as Class 100K [<100,000 particles of 0.5µm size, per cubic foot, and <700 particles of 5µm size, per cubic foot]

I'll stick my neck out and say that it is likely that most facilities employing fine wire bonding [<2 mil  ~80µm] are in the Class 1K to 10K range.  Something as 'macro' as heavy wire aluminum is totally different.

It depends on what you make - Space level with PIND requirements?  Optical application?  Jelly-bean commercial parts?

We are either Class 1,000 or 10,000 - depending on the product and the clean room.

Hope that helps

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Friday, July 20, 2007 9:41 AM
To: [log in to unmask]
Subject: [TN] Wire bonding Clean Rooms?

Could anyone share with me the level (if any) of cleanroom you maintain
for your wire bonding operations?

Are you aware of any industry standards that would cover this topic?

Thanks

Rich K 

  

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