We are encountering a problem with solder mask defined pads on the boards that are going through ENIG. We are using Tiayo LPI and low temperature nickel. We have tried everything from pumice scrubbing the copper prior to SM, micro-etching, micro-etching and then using an adhesion promoter, even UV bumping with no luck. Other then making the boards full body ENIG are there any other suggestions.
Thanks
_________________________________________________________________
Missed the show? Watch videos of the Live Earth Concert on MSN.
http://liveearth.msn.com
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
