You can double the thickness of the tin beyond the IPC spec and still have
issues. With non-RoHS 2 reflows on immersion tin can be done with care. On
RoHS it is not possible. Tony Steinke is correct. 

Good luck. 
Steve Kelly


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
Sent: July-17-07 4:14 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion Tin

The thickness of the Tin finish is below the minimum.

Short term solution:
Lower peak profile as possible.
Use Nitrogen

Long term
Replace supplier of PCBs
Corrective actions of existing supplier 

Best Regards
Reuven ROKAH 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Larry K
Sent: Tuesday, July 17, 2007 10:35 PM
To: [log in to unmask]
Subject: [TN] Immersion Tin

We are having problems with solderability of the PCB on oursecond side
reflow. Everything looks good after reflowon the first side but when we
run the second side we have non-wetting of the pads of this side. 
   
  Just to ensure we were doing everything correctly,we switched sides
(we did the second side first and then did the first side as a second
reflow) and the problem was still after the second reflow. We are
thinking this validated our process because the side causing us problems
switched with our experiment. As I said in the suject line, this is
Immersion Tin. Any suggestions for a cure?
  thanks,
  Larry

 
---------------------------------
 Get your own web address.
 Have a HUGE year through Yahoo! Small Business.

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